Master Ceramic/MCM Designer Suite from CAD Design Software

The most advanced MCM design software with the ability to do any number of die stacks, individual dies on one or both sides of the substrate including unlimited Embedded passives and unlimited cavity structures.

This suite supports the design and manufacturing of all types of Micro-electronic MCMs on all types of Organic and Ceramic substrates (Laminate, LTCC, HTCC, Thick Film Ceramic, Thin Film Ceramic and new undefined technologies).

It also includes an interactive auto-router that contains a powerful push program that maintains complex clearance rules from a configurable grid including multiple differential pair gaps. Two simulation links of your choice is included.

New concepts developed for all types of Ceramic Hybrids including Thick Film, Thin Film, LTCC and HTCC. Designs can go quickly from concept to manufactured product, which will fuel more progress to bring a largely manual process to maximum automation, to include automatic masks, panels and generation of 3D analysis models.

Maximum automation results in expanded use of technologies that are now shrinking. Technologies that have complex and difficult to understand design and manufacturing steps have a hard time gaining wide acceptance.

• Die to Capacitor Bonding
• Die to Substrate Bonding
• Links to HFSS & CST Analysis
• Supports All Design Types